Home Page | About Us| Contact

PINLESS MACHINE
(MODEL 211 SINGLE DRAWER)

MACHINE SIZE:

INTRODUCTION

STRONG OF THE SUCCESS OF INDUBOND 130 MACHINE, CEDAL EQUIPMENT © ADDS TO ITS PRODUCT A NEW
TECHNOLOGY: PINLESS MACHINE MOD.211 .
THIS IS A SINGLE DRAWER MACHINE WITH CCD REGISTRATION SYSTEM. THE INDUCTION WELDING PROVIDES SEVERAL BENEFITS, SPECIFIC TO THE SYSTEM, SUCH AS VERY HIGH
STICKING RELIABILITY.

INNER LAYERS

THE INNER LAYERS ARE PREPARED FOR AN OPTICAL REGISTRATION PROCESS.
DEDICATED AREAS FOR WELDING ARE NOT NECESSARY: THE INNER LAYER FRAME IS USED FOR THIS PURPOSE.
CEDAL EQUIPMENT WOULD SUGGESTS THE FRAME FOR GOOD PROCESS RELIABILITY.

TARGET FOR OPTICAL REGISTRATION AND WELDING ZONES

TWO TARGETS FOR OPTICAL REGISTRATION AND 4 DOUBLE WELDING ZONE ARE REQUESTED .

WELDING ZONES

ALL INNER LAYER MUST HAVE ZONES FOR WELDING OPERATIONS.
THE CUSTOMER CAN CHOOSE THE POSITION OF THE 4 WELDING ZONES IN MIND THAT EACH AREA
HAS A WELD IN TWO POINTS 70mm BETWEEN THEM.

THE PINLESS PROCESS

THE BLACKED INNER LAYERS ARE ALIGNED AND BONDED ONE OVER THE OTHER AND THEN WELDED BY USING THE INDUCTIVE CURRENT.
EVERY INNER LAYER HAS TO BE PROVIDED WITH COPPER DOTS TARGETS ON ONE SIDE
OF THE LAYER FOR REGISTRATION PURPOSE.
CCD CAMERA DETECTS THE COPPER DOTS AND SUPPLIES INFORMATION TO THE COMPUTER.
MEANWHILE THE SYSTEM IS MOVING CLOSE TO THE REGISTRATION AREA WHERE THE LAYER
IS POSITIONED ON THE TEMPLATE.
WHEN THE CORRECT POSITION IN FOUNDED, A MECHANICAL HAND SYSTEM CLAMPS
THE INNER LAYER DOWN ON THE TEMPLATE.
THEN THE PREPREG WILL BE POSITIONED ONTHE LAYER ITSELF.
A SECOND LAYER WILL BE PICKED-UP AND POSITIONED OVER THE FIRST ONE.
WHEN THE BOOK IS READY (ALL INNER LAYER AND PREPREG IN POSITION) , THE BONDING
HEADS START THE WELDING ACTION.
AFTER THAT, THE WELDED BOOK IS MANUALLY REMOVED FROM THE MACHINE.

MACHINE CONFIGURATION

PERFORMANCES

PANEL SIZE mm ( inches)
min. 457 x 304 mm (18" x 12" ) ÷ max. 680 x 584 ( 26.8" x 23" )
PANEL THICKNESS mm ( mils )
min. NO LIMITATION ÷ max. 8mm ( 400 mils)
INNER LAYER THICKNESS mm ( mils )
min. 0,050 mm ( 2 mils) ÷ max. 1 mm (40 mils)
COPPER THICKNESS Microns( oz )
min. 9 micrometers (1/3 Oz) ÷ max*. NO LIMITATION.
(* THICKNESS GREATER THAN 140 microns
MUST BE TESTED BEFORE.)

INNER LAYERS LAY - OUT

TARGETS

COPPER DOTS: ø 0,8mm (31mils)
ETCHED AREA AROUND 8 ÷ 13 (1/3 inches ÷ 0,15inches)
INNER LAYER THICKNESS mm ( mils )
min. 0,050 mm ( 2 mils) ÷ max. 1 mm (40 mils)

COPPER AREAS FOR WELDING

NUMBER: 4
PATTERN CUSTOMER FRAME.
Top of the page | Back| Home Page
Copyright 2011 © Cedal Equipment ® S.r.l . All rights reserved | P.IVA 03903710964 |